Semiconductor Chip Fabrication Processes for 2nm and 1nm Nodes

Discover the advanced manufacturing technologies shaping the future of semiconductor devices. This live online course provides a comprehensive introduction to semiconductor chip fabrication, with a focus on advanced 2nm and emerging 1nm technology nodes. Explore the complete fabrication flow, from wafer preparation and transistor engineering to advanced lithography, thin-film deposition, etching, interconnects, and packaging.

Designed to bridge fundamental semiconductor knowledge with next-generation manufacturing concepts, this course will help participants understand how leading-edge chips are designed, fabricated, and integrated. Gain valuable insights into the process challenges, materials, equipment, and innovations driving the semiconductor industry toward smaller, faster, and more energy-efficient devices.

Course Overview

• Course Duration: 1-hour live online session.
• Course Format: Instructor-led online seminar featuring technical explanations, industry insights, and interactive Q&A.
• Target Audience: Semiconductor engineering professionals, university students, researchers, PhD scholars, fresh graduates, and anyone interested in advanced semiconductor manufacturing and next-generation chip technologies.
• Key Learning Objectives:
• Understand the complete semiconductor fabrication process, from wafer preparation to final packaging.
• Explore advanced process technologies relevant to 2nm and emerging 1nm-class semiconductor nodes.
• Learn about advanced lithography, atomic-scale deposition, precision etching, and transistor fabrication.
• Understand the evolution of transistor architectures, including FinFET, Gate-All-Around (GAA), and nanosheet technologies.
• Identify major manufacturing challenges involving materials, process integration, variability, defects, and yield.
• Develop a broader understanding of future semiconductor manufacturing trends and career opportunities.

Course Highlights

• Highlight 1: Advanced Node Technology Insights
• Explore the technological innovations behind 2nm and emerging 1nm-class chips, including advanced transistor architectures, scaling challenges, and materials engineering.
• Highlight 2: End-to-End Fabrication Knowledge
• Follow the major stages of semiconductor manufacturing, including wafer preparation, deposition, lithography, etching, doping, metallization, process control, and packaging.
• Highlight 3: Expert-Led Learning and Interactive Q&A
• Learn from semiconductor research and process-development experience, gain practical perspectives on advanced fabrication, and ask questions during the live session. Participants will receive an e-certificate of participation.

Instructor

• Instructor Bio: The course is led by a semiconductor technology professional with extensive experience in semiconductor fabrication, advanced materials, and next-generation memory research.
• Instructor Expertise: The instructor brings 14 years of semiconductor fab experience spanning memory and logic technologies, alongside research and process-development experience in emerging non-volatile memories and advanced materials. Areas of expertise include ALD, CVD, PE-CVD, PE-ALD, LPCVD, sputtering, DUV lithography, rapid thermal processing, reactive ion etching, and advanced 2D-material-based electronic devices.

Course Curriculum

Module 1: Fundamentals of Semiconductor Chip Fabrication

• Overview of semiconductor manufacturing and the complete fabrication flow.
• Silicon wafers, wafer preparation, cleaning, and surface conditioning.
• Introduction to cleanroom environments, contamination control, and process integration.
• Overview of front-end-of-line (FEOL), middle-of-line (MOL), and back-end-of-line (BEOL) processing.

Module 2: Advanced Fabrication Processes for 2nm and 1nm-Class Nodes

• Advanced lithography: EUV lithography, patterning strategies, and critical-dimension control.
• Thin-film deposition using ALD, CVD, and other advanced deposition techniques.
• Precision etching, atomic-scale process control, and selective material removal.
• Transistor scaling: FinFET to Gate-All-Around nanosheet architectures.
• Advanced materials, contact resistance, interconnect scaling, and process integration challenges.
• Manufacturing variability, defect control, and yield optimization at advanced technology nodes.